| 标准编号 | IEC 61190-1-3:2007/AMD1:2010 |
| 标准名称 | Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
| 主编部门 | |
| 标准状态 | |
| 出版社 | |
| 批准文号 | |
| 发布日期 | |
| 实施日期 | |
| 废止日期 | |
| 替换信息 | |
| 前言 | |
| 无 |
