（清空日期可显示全部记录）
| 标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
|---|---|---|---|---|---|
| IEC 62820-1-1:2016 | Building intercom systems - Part 1-1: System requirements - General | ||||
| IEC 60065:1965/AMD2:1971 | Amendment 2 - Safety requirements for mains operated electronic and related equipment for domestic and similar general use | ||||
| IEC 61482-2:2009 | Live working - Protective clothing against the thermal hazards of an electric arc - Part 2: Requirements | ||||
| IEC 61822:2009 | Electrical installations for lighting and beaconing of aerodromes - Constant current regulators | ||||
| IEC 61823:2002 | Electrical installations for lighting and beaconing of aerodromes - AGL series transformers | ||||
| IEC 61810-2-1:2011 | Electromechanical elementary relays - Part 2-1: Reliability - Procedure for the verification of B<sub>10</sub> values | ||||
| IEC 61810-3:2015 | Electromechanical elementary relays - Part 3: Relays with forcibly guided (mechanically linked) contacts | ||||
| IEC 61810-7:2006 | Electromechanical elementary relays - Part 7: Test and measurement procedures | ||||
| IEC 61811-1:2015 | Electromechanical telecom elementary relays of assessed quality - Part 1: Generic specification and blank detail specification | ||||
| IEC 60068-2-58:2015 | Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | ||||
| IEC 60068-2-69:2017 | Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method | ||||
| IEC 60068-2-82:2007 | Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components | ||||
| IEC 60094-2:1994 | Magnetic tape sound recording and reproducing systems - Part 2: Calibration tapes | ||||
| IEC TR 60068-3-12:2014 | Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile | ||||
| IEC 60094-3:1979/AMD2:1988 | Amendment 2 - Magnetic tape sound recording and reproducing systems. Part 3: Methods of measuring the characteristics of recording and reproducing equipment for sound on magnetic tape | ||||
| IEC 60094-3:1979/AMD3:1996 | Amendment 3 - Magnetic tape sound recording and reproducing systems. Part 3: Methods of measuring the characteristics of recording and reproducing equipment for sound on magnetic tape | ||||
| IEC PAS 61182-12:2014 | Generic requirements for printed board assembly products manufacturing description data and transfer methodology | ||||
| IEC 60721-3-2:1985/AMD1:1991 | Amendment 1 - Classification of environmental conditions. Part 3: Classification of groups of environmental parameters and their severities. Transportation. | ||||
| IEC 63004:2015 | Standard for receiver fixture interface | ||||
| IEC 60094-4:1986 | Magnetic tape sound recording and reproducing systems. Part 4: Mechanical magnetic tape properties | ||||
| IEC 61188-5-1:2002 | Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements | ||||
| IEC 61558-2-16:2009 | Safety of transformers, reactors, power supply units and similar products for supply voltages up to 1 100 V - Part 2-16: Particular requirements and tests for switch mode power supply units and transformers for switch mode power supply units | ||||
| IEC 61558-2-16:2009/AMD1:2013 | Amendment 1 - Safety of transformers, reactors, power supply units and similar products for supply voltages up to 1 100 V - Part 2-16: Particular requirements and tests for switch mode power supply units and transformers for switch mode power supply units | ||||
| IEC 60098:1987 | Analogue audio disk records and reproducing equipment | ||||
| IEC 61189-1:1997+AMD1:2001 CSV | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology | ||||
| IEC 61189-1:1997 | Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology | ||||
| IEC 60107-3:1988/AMD1:1999 | Amendment 1 - Recommended methods of measurement on receivers for television broadcast transmissions. Part 3: Electrical measurements on multichannel sound television receivers using subcarrier systems | ||||
| IEC 60107-4:1988+AMD1:1999 CSV | Recommended methods of measurement on receivers for television broadcast transmissions - Part 4: Electrical measurements on multichannel sound television receivers using the two-carrier FM-system | ||||
| IEC 60721-3-2:1985/AMD2:1993/COR1:1993 | Corrigendum 1 to amendment 2 | ||||
| IEC 60107-4:1988/AMD1:1999 | Amendment 1 - Recommended methods of measurement on receivers for television broadcast transmissions. Part 4: Electrical measurements on multichannel sound television receivers using the two-carrier FM-system | ||||
| IEC 60107-5:1992+AMD1:1999 CSV | Recommended methods of measurements on receivers for television broadcast transmissions - Part 5: Electrical measurements on multichannel sound television receivers using the NICAM two-channel digital sound-system | ||||
| IEC 62525:2007 | Standard Test Interface Language (STIL) for Digital Test Vector Data | ||||
| IEC 61189-3-719:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling | ||||
| IEC 61189-5-1:2016 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies | ||||
| IEC 61189-5-2:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies | ||||
| IEC 61189-5-4:2015 | Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies | ||||
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | ||||
| IEC 60268-5:2003+AMD1:2007 CSV | Sound system equipment - Part 5: Loudspeakers | ||||
| IEC 61190-1-3:2007 | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | ||||
| IEC 61190-1-3:2007/AMD1:2010 | Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | ||||
| IEC 61191-4:1998 | Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies | ||||
| IEC 61193-2:2007 | Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages | ||||
| IEC 61249-2-19:2001 | Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad | ||||
| IEC 61249-2-6:2003 | Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | ||||
| IEC 61249-2-9:2003 | Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | ||||
| IEC 61249-2-10:2003 | Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | ||||
| IEC 61249-2-13:1999 | Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad | ||||
| IEC 61249-2-18:2002 | Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad | ||||
| IEC 61249-2-34:2009 | Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad | ||||
| IEC TR 60728-3-2:2016 | Cable networks for television signals, sound signals and interactive services - Part 3-2: Method of measurement of 5<sup>th</sup> order non-linearity for active electronic equipment using five carriers |
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