（清空日期可显示全部记录）
| 标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
|---|---|---|---|---|---|
| IEC 60098:1964/AMD2:1971 | Amendment 2 - Processed disk records and reproducing equipment | ||||
| IEC 60107-1:1977/AMD1:1987 | Amendment 1 - Recommended methods of measurement on receivers for television broadcast transmissions. Part 1: General considerations. Electrical measurements other than those at audio-frequencies. | ||||
| IEC 60098:1964/AMD3:1972 | Amendment 3 - Processed disk records and reproducing equipment | ||||
| IEC 60094-2:1975/AMD2:1991 | Amendment 2 - Magnetic tape recording and reproducing systems - Part 2: Calibration tapes | ||||
| IEC 61822:2002 | Electrical installations for lighting and beaconing of aerodromes - Constant current regulators | ||||
| IEC 60094-2:1975/COR1:1976 | corrigendum 1 - Magnetic tape recording and reproducing systems - Part 2: Calibration tapes | ||||
| IEC 61936-1:2002 | Power installations exceeding 1 kV a.c. - Part 1: Common rules | ||||
| IEC 61558-2-9:2002 | Safety of power transformers, power supply units and similar products - Part 2-9: Particular requirements for transformers for class III handlamps for tungsten filament lamps | ||||
| IEC 61558-1:1997+AMD1:1998 CSV | Safety of power transformers, power supply units and similar - Part 1: General requirements and tests | ||||
| IEC 61558-2-4:1997 | Safety of power transformers, power supply units and similar - Part 2: Particular requirements for isolating transformers for general use | ||||
| IEC 61558-2-2:1997 | Safety of power transformers, power supply units and similar - Part 2-2: Particular requirements for control transformers | ||||
| IEC 61558-2-1:1997 | Safety of power transformers, power suply units and similar - Part 2: Particular requirements for separating transformers for general use | ||||
| IEC 61558-2-5:1997 | Safety of power transformers, power supply units and similar - Part 2-5: Particular requirements for shaver transformers and shaver supply units | ||||
| IEC 61558-2-3:1999 | Safety of power transformers, power supply units and similar devices - Part 2-3: Particular requirements for ignition transformers for gas and oil burners | ||||
| IEC 61558-1:1997/ISH1:2003 | Interpretation sheet 1 - Safety of power transformers, power supply units and similar - Part 1: General requirements and tests | ||||
| IEC 62326-1:1996 | Printed boards - Part 1: Generic specification | ||||
| IEC 61760-2:1998 | Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide | ||||
| IEC 61191-1:1998 | Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies | ||||
| IEC 61190-1-3:2002 | Attachment materials for electronic assembly - Part 1-3:Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | ||||
| IEC 61190-1-2:2002 | Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly | ||||
| IEC 61191-2:1998 | Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies | ||||
| IEC 61190-1-2:2007 | Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly | ||||
| IEC 61189-2:1997/COR1:1997 | Corrigendum 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures | ||||
| IEC 61189-2:1997 | Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures | ||||
| IEC 61188-7:2009 | Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | ||||
| IEC 61189-2:1997/AMD1:2000 | Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures | ||||
| IEC 61188-7:2009/COR1:2009 | Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | ||||
| IEC 60068-2-21:1960 | Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test U: Robustness of terminations | ||||
| IEC 60068-2-21:1983/AMD1:1985 | Amendment 1 - Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices | ||||
| IEC 60068-2-21:1975 | Basic environmental testing procedures - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices | ||||
| IEC 60068-2-21:1983 | Environmental testing. Part 2: Tests. Test U: Robustness of terminations and integral mounting devices | ||||
| IEC 60068-2-21:1975/AMD1:1979 | Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test U: Robustness of terminations and integral mounting devices | ||||
| IEC 60068-2-20:1960 | Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering | ||||
| IEC 60068-2-20:1968 | Basic environmental testing procedures for electronic components and electronic equipment - Part 2: Tests - Test T: Soldering | ||||
| IEC 60068-2-20:1979 | Environmental testing. Part 2: Tests. Test T: Soldering | ||||
| IEC 60068-2-20:1979/AMD1:1986 | Amendment 1 - Basic environmental testing procedures - Part 2: Tests - Test T: Soldering | ||||
| IEC 60068-2-58:1999 | Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | ||||
| IEC 60068-2-20:1979/AMD2:1987 | Amendment 2 - Basic environmental testing procedures - Part 2-20: Tests - Test T: Soldering | ||||
| IEC 61811-1:1999 | Electromechanical non-specified time all-or-nothing relays of assessed quality - Part 1: Generic specification | ||||
| IEC 61810-1:2003 | Electromechanical elementary relays - Part 1: General and safety requirements | ||||
| IEC 61788-13:2003 | Superconductivity - Part 13: AC loss measurements - Magnetometer methods for hysteresis loss in Cu/Nb-Ti multifilamentary composites | ||||
| IEC 61788-12:2002 | Superconductivity - Part 12: Matrix to superconductor volume ratio measurement - Copper to non-copper volume ratio of Nb3Sn composite superconducting wires | ||||
| IEC 60695-11-20:1999 | Fire hazard testing - Part 11-20: Test flames - 500 W flame test methods | ||||
| IEC 61788-5:2000 | Superconductivity - Part 5: Matrix to superconductor volume ratio measurement - Copper to superconductor volume ratio of Cu/Nb-Ti composite superconductors | ||||
| IEC 60695-10-2:1995 | Fire hazard testing - Part 10: Guidance and test methods for the minimization of the effects of abnormal heat on electrotechnical products involved in fires - Section 2: Method for testing products made from non-metallic materials for resistance to heat using the ball pressure test | ||||
| IEC 60695-10-2:2003 | Fire hazard testing - Part 10-2: Abnormal heat - Ball pressure test | ||||
| IEC TS 60695-11-4:2004 | Fire hazard testing - Part 11-4: Test flames - 50 W flame - Apparatus and confirmational test method | ||||
| IEC 60695-11-2:2003 | Fire hazard testing - Part 11-2: Test flames - 1 kW nominal pre-mixed flame - Apparatus, confirmatory test arrangement and guidance | ||||
| IEC 60695-11-2:2003/COR1:2006 | Corrigendum 1 - Fire hazard testing - Part 11-2: Test flames - 1 kW nominal pre-mixed flame - Apparatus, confirmatory test arrangement and guidance | ||||
| IEC TS 60695-9-2:2005 | Fire hazard testing - Part 9-2: Surface spread of flame - Summary and relevance of test methods |
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