（清空日期可显示全部记录）
| 标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
|---|---|---|---|---|---|
| IEC 60127-4:1996 | Miniatures fuses - Part 4: Universal Modular Fuse-Links (UMF) | ||||
| IEC 60358:1971 | Coupling capacitors and capacitor dividers | ||||
| IEC 60269-2:1973 | Low-voltage fuses - Part 2: Supplementary requirements for fuses for industrial applications | ||||
| IEC 60317-25:1990+AMD1:1997+AMD2:1997 CSV | Specifications for particular types of winding wires - Part 25: Polyester or polyesterimide overcoated with polyamide-imide enamelled round aluminium wire, class 200 | ||||
| IEC 60317-23:1990+AMD1:1997+AMD2:1999 CSV | Specifications for particular types of winding wires - Part 23: Solderable polyesterimide enamelled round copper wire, class 180 | ||||
| IEC 60269-4:1980 | Low-voltage fuses - Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices | ||||
| IEC 60269-4:1986/AMD1:1995 | Amendment 1 - Low-voltage fuses. Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices | ||||
| IEC 60269-4:1986/AMD2:2002 | Amendment 2 - Low-voltage fuses. Part 4: Supplementary requirements for fuse-links for the protection of semiconductor devices | ||||
| IEC 60079-14:1996 | Electrical apparatus for explosive gas atmospheres - Part 14: Electrical installations in hazardous areas (other than mines) | ||||
| IEC 60079-7:2001 | Electrical apparatus for explosive gas atmospheres - Part 7: Increased safety "e" | ||||
| IEC 60317-21:1990/AMD2:1999 | Amendment 2 - Specifications for particular types of winding wires. Part 21: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155 | ||||
| IEC 60094-1:1981 | Magnetic tape sound recording and reproducing systems. Part 1: General conditions and requirements | ||||
| IEC 60529:1989+AMD1:1999 CSV/COR2:2007 | Corrigendum 2 - Degrees of protection provided by enclosures (IP Code) | ||||
| IEC 60394-3-1:1976 | Varnished fabrics for electrical purposes. Part 3-1: Specifications for individual materials. Oleoresinous varnish-cotton base, OR/C | ||||
| IEC 60064:1993/AMD1:2000 | Amendment 1 - Tungsten filament lamps for domestic and similar general lighting purposes - Performance requirements | ||||
| IEC 61008-1:2010/AMD2:2013/COR1:2014 | Corrigendum 1 - Amendment 2 - Residual current operated circuit-breakers without integral overcurrent protection for household and similar uses (RCCBs) - Part 1: General rules | ||||
| IEC 60122-1:1976 | Quartz crystal units for frequency control and selection - Part 1: Standard values and test conditions | ||||
| IEC 60317-21:1990/AMD1:1997 | Amendment 1 - Specifications for particular types of winding wires. Part 21: Solderable polyurethane enamelled round copper wire overcoated with polyamide, class 155 | ||||
| IEC 60317-13:1990/AMD1:1997 | Amendment 1 - Specifications for particular types of winding wires. Part 13: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200 | ||||
| IEC 61984:2001 | Connectors - Safety requirements and tests | ||||
| IEC 60747-9:1998/AMD1:2001 | Amendment 1 - Semiconductor devices - Part 9: Insulated-gate bipolar transistors (IGBTs) | ||||
| IEC 60747-6:2000 | Semiconductor devices - Part 6: Thyristors | ||||
| IEC 60747-2:1983/AMD1:1992 | Amendment 1 - Semiconductor devices - Discrete devices - Part 2: Rectifier diodes | ||||
| IEC 60747-3:1985/AMD1:1991 | Amendment 1 - Semiconductor devices - Discrete devices - Part 3: Signal (including switching) and regulator diodes | ||||
| IEC 60317-13:1990/AMD2:1997 | Amendment 2 - Specifications for particular types of winding wires. Part 13: Polyester or polyesterimide overcoated with polyamide-imide, enamelled round copper wire, class 200 | ||||
| ISO/IEC 19784-1:2006/AMD1:2007 | Amendment 1 - Information technology -- Biometric application programming interface -- Part 1: BioAPI specification - BioGUI specification | ||||
| IEC 60191-4:1999 | Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages | ||||
| IEC 60086-1:1971/AMD3:1974 | Amendment 3 - Primary cells and batteries - Part 1: General | ||||
| ISO/IEC 15897:2011/COR1:2013 | Corrigendum 1 - Information technology -- User interfaces -- Procedures for the registration of cultural elements - | ||||
| IEC 60317-13:1990+AMD1:1997+AMD2:1997 CSV | Specifications for particular types of winding wires - Part 13: Polyester or polyesterimide overcoated with polyamide-imide enamelled round copper wire, class 200 | ||||
| IEC 60317-4:1990/AMD2:1999 | Amendment 2 - Specifications for particular types of winding wires. Part 4: Solderable polyurethane enamelled round copper wire, class 130 | ||||
| IEC 60317-4:1990+AMD1:1997+AMD2:1999 CSV | Specifications for particular types of winding wires - Part 4: Solderable polyurethane enamelled round copper wire, class 130 | ||||
| IEC 60317-0-5:1992+AMD1:1997+AMD2:1999 CSV | Specifications for particular types of winding wires - Part 0-5: General requirements - Glass-fibre braided resin or varnish impregnated, bare or enamelled rectangular copper wire | ||||
| ISO/IEC 13240:2001/COR1:2003 | Corrigendum 1 - Information technology -- Document description and processing languages -- Interchange Standard for Multimedia Interactive Documents (ISMID) - | ||||
| ISO/IEC 10206:1991 | Information technology -- Progamming languages -- Extended Pascal | ||||
| IEC 60317-0-4:1990 | Specifications for particular types of winding wires. Part 0: General requirements. Section 4: Glass-fibre wound bare enamelled rectangular copper wire | ||||
| IEC 60317-0-4:1997 | Specifications for particular types of winding wires - Part 0:General requirements - Section 4: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire | ||||
| IEC 60317-0-4:1997/AMD1:1999 | Amendment 1 - Specifications for particular types of winding wires - Part 0:General requirements - Section 4: Glass-fibre wound resin or varnish impregnated, bare or enamelled rectangular copper wire | ||||
| IEC 60317-0-1:1990 | Specifications for particular types of winding wires. Part 0: General requirements. Section 1: Enamelled round copper wire | ||||
| IEC 60556:1982/AMD1:1997 | Amendment 1 - Measuring methods for properties of gyromagnetic materials intended for application at microwave frequencies | ||||
| IEC 60205:1966 | Calculation of the effective parameters of magnetic piece parts | ||||
| IEC PAS 61338-2:2000 | Waveguide type dielectric resonators - Part 2: Guide to the use of waveguide type dielectric resonators | ||||
| IEC 61240:1994 | Piezoelectric devices - Preparation of outline drawings of surface-mounted devices (SMD) for frequency control and selection - General rules | ||||
| IEC 60679-1:1997 | Quartz crystal controlled oscillators of assessed quality - Part 1: Generic specification | ||||
| IEC 60689:1980 | Measurements and test methods for 32 kHz quartz crystal units for wrist watches and standard values | ||||
| IEC 60758:2008 | Synthetic quartz crystal - Specifications and guidelines for use | ||||
| IEC 60122-3:1962 | Quartz crystal units for oscillators - Part 3: Standard outlines | ||||
| IEC 60444-6:1995 | Measurement of quartz crystal unit parameters - Part 6: Measurement of drive level dependence (DLD) | ||||
| IEC 60444-8:2003 | Measurement of quartz crystal unit parameters - Part 8: Test fixture for surface mounted quartz crystal units | ||||
| IEC 60122-3:1977/AMD2:1991 | Amendment 2 - Quartz crystal units for frequency control and selection. Part 3: Standard outlines and pin connections |
若您对上表中数据有任何疑问，请与网站联系。
