| 标准编号 | IEC 60191-6-4:2003 |
| 标准名称 | Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) |
| 主编部门 | |
| 标准状态 | |
| 出版社 | |
| 批准文号 | |
| 发布日期 | |
| 实施日期 | |
| 废止日期 | |
| 替换信息 | |
| 前言 | |
| 无 |
