| 标准编号 | DIN 50456-1 (1991-09) (Withdrawn) |
| 标准名称 | Testing Of Materials For Semiconductor Technology - Method For The Characterisation Of Moulding Compounds For Electronic Components - Determination Of The Thermo-mechanical Dilatation Of Epoxy Resin Moulding Compounds |
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| 发布日期 | 1991-09-01 |
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| 前言 | |
| 无 |