| 标准编号 | KS C IEC 60068-2-58:2007 |
| 标准名称 | Environmental testing-Part 2-58:Tests-Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices(SMD) |
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| 发布日期 | 2007-11-29 |
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| 前言 | |
| 无 |
