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标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
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IEC 60061-1:1969/AMD23:1999 | Amendment 23 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1:1969/AMD28:2002 | Amendment 28 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1:1969/AMD47:2011 | Amendment 47 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 1: Lamp caps | ||||
IEC 60061-3:1969/AMD41:2010 | Amendment 41 - Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 3: Gauges | ||||
IEC 60061-1F:1975 | Supplement 6 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1E:1972 | Supplement 5 - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1H:1977 | Eighth supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1K:1983 | Tenth supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-1C:1971 | Third supplement - Lamp caps and holders together with gauges for the control of interchangeability and safety. Part 1: Lamp caps | ||||
IEC 60061-3K:1987 | Lamp caps and holders together with gauges for the control of interchangeability and safety - Part 3: Gauges - Tenth supplement. | ||||
IEC TS 61245:2015 | Artificial pollution tests on high-voltage ceramic and glass insulators to be used on d.c. systems | ||||
IEC 61462:2007 | Composite hollow insulators - Pressurized and unpressurized insulators for use in electrical equipment with rated voltage greater than 1 000 V - Definitions, test methods, acceptance criteria and design recommendations | ||||
IEC 62772:2016 | Composite hollow core station post insulators for substations with a.c. voltage greater than 1 000 V and d.c. voltage greater than 1 500 V - Definitions, test methods and acceptance criteria | ||||
IEC TS 62371:2008 | Characteristics of hollow pressurised and unpressurised ceramic and glass insulators for use in electrical equipment with rated voltages greater than 1000 V | ||||
IEC 62153-4-6:2006 | Metallic communication cable test methods - Part 4-6: Electromagnetic compatibility (EMC) - Surface transfer impedance - Line injection method | ||||
IEC 60191-2:1966 | Mechanical standardization of semiconductor devices. Part 2: Dimensions | ||||
IEC 60191-2:1966/AMD7:2002 | Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions | ||||
IEC 60191-2:1966/AMD5:2002 | Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions | ||||
IEC 60153-2:2016 | Hollow metallic waveguides - Part 2: Relevant specifications for ordinary rectangular waveguides | ||||
IEC 60191-6-3:2000 | Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP) | ||||
IEC 62830-3:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting | ||||
IEC 62830-2:2017 | Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting | ||||
IEC 62779-2:2016 | Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances | ||||
IEC 62779-1:2016 | Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements | ||||
IEC 60191-3:1999 | Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits | ||||
IEC 60191-6:2009 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | ||||
IEC 60749-6:2017 | Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature | ||||
IEC 60191-6-18:2010/COR2:2010 | Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | ||||
IEC 60191-6-18:2010/COR1:2010 | Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | ||||
IEC 60917-1:1998+AMD1:2000 CSV | Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard | ||||
IEC 60917-1:1998 | Modular order for the development of mechanical structures for electronic equipment practices - Part 1: Generic standard | ||||
IEC 60917-2-3:2006 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2-3: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Extended detail specification - Dimensions for subracks, chassis, backplanes, front panels and plug-in units | ||||
IEC 60917-2-1:1993 | Modular order for the development of mechanical structures for electronic equipment practices - Part 2: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Section 1: Detail specification - Dimensions for cabinets and racks | ||||
IEC 60401-2:2009 | Terms and nomenclature for cores made of magnetically soft ferrites - Part 2: Reference of dimensions | ||||
IEC 62317-11:2015 | Ferrite cores - Dimensions - Part 11: EC-cores for use in power supply applications | ||||
IEC 60862-3:2003 | Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines | ||||
IEC 60689:2008 | Measurement and test methods for tuning fork quartz crystal units in the range from 10 kHz to 200 kHz and standard values | ||||
IEC 60851-2:2009+AMD1:2015 CSV | Winding wires - Test methods - Part 2: Determination of dimensions | ||||
IEC 61854:1998 | Overhead lines - Requirements and tests for spacers | ||||
IEC 60851-4:2016 | Winding wires - Test methods - Part 4: Chemical properties | ||||
IEC TR 60870-1-4:1994 | Telecontrol equipment and systems - Part 1: General considerations - Section 4: Basic aspects of telecontrol data transmission and organization of standards IEC 870-5 and IEC 870-6 | ||||
IEC TS 60870-5-601:2015 | Telecontrol equipment and systems - Part 5-601: Transmission protocols - Conformance test cases for the IEC 60870-5-101 companion standard | ||||
IEC 61968-3:2017 | Application integration at electric utilities - System interfaces for distribution management - Part 3: Interface for network operations | ||||
IEC TR 61850-90-12:2015 | Communication networks and systems for power utility automation - Part 90-12: Wide area network engineering guidelines | ||||
IEC 62885-2:2016 | Surface cleaning appliances - Part 2: Dry vacuum cleaners for household or similar use - Methods for measuring the performance | ||||
IEC 60665:1980 | A.C. electric ventilating fans and regulators for household and similar purposes | ||||
IEC 61347-2-10:2000+AMD1:2008 CSV | Lamp controlgear - Part 2-10: Particular requirements for electronic invertors and convertors for high-frequency operation of cold start tubular discharge lamps (neon tubes) | ||||
IEC 61347-2-13:2014 | Lamp controlgear - Part 2-13: Particular requirements for d.c. or a.c. supplied electronic controlgear for LED modules | ||||
IEC 60901:1996/AMD2:2000 | Amendment 2 - Single-capped fluorescent lamps - Performance specifications | ||||
IEC 62386-206:2009 | Digital addressable lighting interface - Part 206: Particular requirements for control gear - Conversion from digital signal into d.c. voltage (device type 5) |
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