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标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
---|---|---|---|---|---|
IEC 61076-1:1995/AMD2:2001 | Amendment 2 - Connectors with assessed quality, for use in d.c., low frequency analogue and in digital high speed data applications - Part 1: Generic specification | ||||
IEC 60352-2:1990 | Solderless connections - Part 2: Solderless crimped connections - General requirements, test methods and practical guidance | ||||
IEC 60747-9:1998+AMD1:2001 CSV | Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) | ||||
IEC 60747-3:1985 | Semiconductor devices - Discrete devices - Part 3: Signal (including switching) and regulator diodes | ||||
IEC 60747-2:1983/AMD2:1993 | Amendment 2 - Semiconductor devices - Discrete devices - Part 2: Rectifier diodes | ||||
IEC 60191-6:1990 | Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | ||||
IEC 60191-6:2004 | Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages | ||||
IEC 60191-5:1987 | Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits. | ||||
IEC 60432-1:1999/AMD2:2011 | Amendment 2 - Incandescent lamps - Safety specifications - Part 1: Tungsten filament lamps for domestic and similar general lighting purposes | ||||
IEC PAS 60191-6-18:2008 | Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA) | ||||
IEC 60748-21:1991 | Semiconductor devices. Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure. | ||||
IEC 60748-4:1987 | Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits. | ||||
IEC 62258-1:2005 | Semiconductor die products - Part 1: Requirements for procurement and use | ||||
IEC PAS 61169-44:2010 | Radio-frequency connectors - Part 44: Sectional specification for SMP push-on radio-frequency coaxial connectors | ||||
IEC PAS 61169-42:2009 | Radio-frequency connectors - Part 42: Sectional specification for CQN series quick lock RF coaxial connectors | ||||
IEC 60457-4:1974 | Rigid precision coaxial lines and their associated precision connectors - Part 4: 60 ohm 21 mm rigid precision coaxial line and associated hermaphroditic precision coaxial connector. Characteristic impedance 50 ohms (Type 9/21) - Characteristic impedance 75 ohms (Type 6/21) | ||||
IEC 60153-2:1964 | Hollow metallic waveguides - Part 2: Relevant specifications for ordinary rectangular waveguides | ||||
IEC 60153-2:1964/AMD1:1968 | Amendment 1 - Hollow metallic waveguides - Part 2: Relevant specifications for ordinary rectangular waveguides | ||||
IEC 61156-6-1:2007 | Multicore and symmetrical pair/quad cables for digital communications - Part 6-1: Symmetrical pair/quad cables with transmission characteristics up to 1 000 MHz - Working area wiring - Blank detail specification | ||||
IEC 60096-0-1:1990+AMD1:2000 CSV | Radio Frequency cables - Part 0-1: Guide to the design of detail specifications - Coaxial cables | ||||
IEC TR 62153-4-1:2010 | Metallic communication cable test methods - Part 4-1: Electromagnetic compatibility (EMC) - Introduction to electromagnetic (EMC) screening measurements | ||||
IEC 61252:1993/AMD2:2017 | Amendment 2 - Electroacoustics - Specifications for personal sound exposure meters | ||||
IEC 61453:1997 | Nuclear instrumentation - Thallium activated sodium iodide detector systems for assay of radionuclides - Calibration and usage | ||||
IEC 60313:1983 | Coaxial cable connectors used in nuclear instrumentation | ||||
IEC 60060-2:1973 | High-voltage test techniques - Part 2: Test procedures | ||||
IEC 60060-2:1994/AMD1:1996 | Amendment 1 - High voltage test techniques - Part 2: Measuring systems | ||||
IEC 60938-1:1988 | Fixed inductors for radio interference suppression. Part 1: Generic specification | ||||
IEC 60915:1987 | Capacitors and resistors for electronic equipment. Preferred dimensions of spindle ends, bushes and for the mounting of single-hole, bush-mounted, spindle-operated electronic components | ||||
IEC 60227-1:1993/AMD2:1998 | Amendment 2 - Polyvinyl chloride insulated cables of rated voltages up to and including 450/750 V - Part 1: General requirements | ||||
IEC 60393-5:1978 | Potentiometers - Part 5: Sectional specification: Single-turn rotary low-power wirewound and non-wirewound potentiometers - Selection of methods of test and general requirements | ||||
IEC 60738-1-1:1998 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-1: Blank detail specification - Current limiting application - Assessment level EZ | ||||
IEC 60738-1-3:1998 | Thermistors - Directly heated positive step-function temperature coefficient - Part 1-3: Blank detail specification - Inrush current application - Assessment level EZ | ||||
IEC 60393-3:1977 | Potentiometers - Part 3: Sectional specification: Single-turn rotary wirewound and non-wirewound precision potentionmeters - Selection of methods of test and general requirements | ||||
ISO 80369-7:2016 | Small-bore connectors for liquids and gases in healthcare applications -- Part 7: Connectors for intravascular or hypodermic applications | ||||
IEC 60384-24:2006 | Fixed capacitors for use in electronic equipment - Part 24: Sectional specification - Surface mount fixed tantalum electrolytic capacitors with conductive polymer solid electrolyte | ||||
IEC 60384-19:1993 | Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric chip d.c. capacitors | ||||
IEC 60384-19:2006 | Fixed capacitors for use in electronic equipment - Part 19: Sectional specification: Fixed metallized polyethylene-terephthalate film dielectric surface mount d.c. capacitors | ||||
IEC 60384-8:1979 | Fixed capacitors for use in electronic equipment - Part 8: Sectional specification: Fixed capacitors of ceramic dielectric, class 1 - Selection of methods of test and general requirements | ||||
IEC 60384-4-1:1985/AMD2:1996 | Amendment 2 - Fixed capacitors for use in electronic equipment. Part 4: Blank detail specification: Aluminium electrolytic capacitors with non solid electrolyte. Assessment level E | ||||
IEC 60384-9-1:1988/COR1:1999 | Corrigendum 1 - Fixed capacitors for use in electronic equipment. Part 9: Blank detail specification: Fixed capacitors of ceramic dielectric, class 2. Assessment level E | ||||
IEC 60384-4:1998/AMD1:2000 | Amendment 1 - Fixed capacitors for use in electronic equipment - Part 4: Sectional specification: Aluminium electrolytic capacitors with solid and non-solid electrolyte | ||||
IEC 60384-4:2007 | Fixed capacitors for use in electronic equipment - Part 4: Sectional specification - Aluminium electrolytic capacitors with solid (MnO<sub>2</sub>) and non-solid electrlyte | ||||
IEC 60384-3-1:1989/COR1:1989 | Corrigendum 1 - Fixed capacitors for use in electronic equipment. Part 3: Blank detail specification: Fixed tantalum chip capacitors. Assessment level E | ||||
IEC 60793-2-50:2002 | Optical fibres - Part 2-50: Product specifications - Sectional specification for class B single-mode fibres | ||||
IEC 60115-1:1982 | Fixed resistors for use in electronic equipment - Part 1: Generic specification | ||||
IEC 60115-8:1989/AMD1:2000 | Amendment 1 - Fixed resistors for use in electronic equipment. Part 8: Sectional specification: Fixed chip resistors | ||||
IEC 60115-1:1982/AMD3:1989 | Amendment 3 - Fixed resistors for use in electronic equipment - Part 1: Generic specification | ||||
IEC 60195:1965 | Method of measurement of current noise generated in fixed resistors | ||||
IEC 60115-1:1982/AMD4:1993 | Amendment 4 - Fixed resistors for use in electronic equipment. Part 1: Generic specification | ||||
IEC 61952:2002 | Insulators for overhead lines - Composite line post insulators for a.c. with a nominal voltage greater than 1000 V |
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