（清空日期可显示全部记录）
| 标准编号 | 标准名称 | 发布日期 | 实施日期 | 废止日期 | 替换信息 |
|---|---|---|---|---|---|
| IEC 62577:2009 | Evaluation of human exposure to electromagnetic fields from a stand-alone broadcast transmitter (30 MHz - 40 GHz) | ||||
| IEC 61747-40-4:2015 | Liquid crystal display devices - Part 40-4: Mechanical testing of display cover glass for mobile devices - Biaxial flexural strength (ring-on-ring) | ||||
| IEC 60554-2:1977/AMD1:1982 | Amendment 1 - Specification for cellulosic papers for electrical purposes. Part 2: Methods of test | ||||
| ISO/IEC 2593:2000 | Information technology -- Telecommunications and information exchange between systems -- 34-pole DTE/DCE interface connector mateability dimensions and contact number assignments | ||||
| ISO/IEC 13818-4:2004/AMD2:2005/COR2:2009 | Corrigendum 2 - Amendment 2 - Information technology -- Generic coding of moving pictures and associated audio information -- Part 4: Conformance testing - Additional audio conformance test sequences | ||||
| IEC 61980-1:2015 | Electric vehicle wireless power transfer (WPT) systems - Part 1: General requirements | ||||
| IEC TR 62443-2-3:2015 | Security for industrial automation and control systems - Part 2-3: Patch management in the IACS environment | ||||
| IEC 60368-4:2000 | Piezoelectric filters of assessed quality - Part 4 : Sectional specification - Capability approval | ||||
| IEC 60444-9:2007 | Measurement of quartz crystal unit parameters - Part 9: Measurement of spurious resonances of piezoelectric crystal units | ||||
| IEC 60444-2:1980 | Measurement of quartz crystal unit parameters by zero phase technique in a pi-network. Part 2: Phase offset method for measurement of motional capacitance of quartz crystal units | ||||
| IEC 62271-101:2006/AMD1:2010 | Amendment 1 - High-voltage switchgear and controlgear - Part 101: Synthetic testing | ||||
| IEC 61338-1:2004 | Waveguide type dielectric resonators - Part 1: Generic specification | ||||
| IEC 62424:2016 | Representation of process control engineering - Requests in P&I diagrams and data exchange between P&ID tools and PCE-CAE tools | ||||
| IEC 60444-8:2016 | Measurement of quartz crystal unit parameters - Part 8 : Test fixture for surface mounted quartz crystal units | ||||
| IEC 60749-2:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure | ||||
| IEC 61248-7:1997 | Transformers and inductors for use in electronic and telecommunication equipment - Part 7: Sectional specification for high-frequency inductors and intermediate frequency transformers on the basis of the capability approval procedure | ||||
| IEC 60444-1:1986 | Measurement of quartz crystal unit parameters by zero phase technique in a pi-network - Part 1: Basic method for the measurement of resonance frequency and resonance resistance of quartz crystal units by zero phase technique in a pi-network | ||||
| IEC 60749-22:2002 | Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength | ||||
| IEC 60335-2-89:2010 | Household and similar electrical appliances - Safety - Part 2-89: Particular requirements for commercial refrigerating appliances with an incorporated or remote refrigerant unit or compressor | ||||
| IEC 60747-6:2016 | Semiconductor devices - Part 6: Discrete devices - Thyristors | ||||
| IEC 60747-5-5:2007 | Semiconductor devices - Discrete devices - Part 5-5: Optoelectronic devices - Photocouplers | ||||
| IEC 60747-4:2007+AMD1:2017 CSV | Semiconductor devices - Discrete devices - Part 4: Microwave diodes and transistors | ||||
| IEC 60747-5-6:2016 | Semiconductor devices - Part 5-6: Optoelectronic devices - Light emitting diodes | ||||
| IEC 60747-2:2016 | Semiconductor devices - Part 2: Discrete devices - Rectifier diodes | ||||
| IEC 60747-5-7:2016 | Semiconductor devices - Part 5-7: Optoelectronic devices - Photodiodes and phototransistors | ||||
| IEC 60747-16-1:2001 | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers | ||||
| IEC 60747-16-1:2001+AMD1:2007+AMD2:2017 CSV | Semiconductor devices - Part 16-1: Microwave integrated circuits - Amplifiers | ||||
| IEC 60335-2-89:2010+AMD1:2012+AMD2:2015 CSV | Household and similar electrical appliances - Safety - Part 2-89: Particular requirements for commercial refrigerating appliances withan incorporated or remote refrigerant unit or compressor | ||||
| IEC 60747-16-4:2004/AMD1:2009 | Amendment 1 - Semiconductor devices - Part 16-4: Microwave integrated circuits - Switches | ||||
| IEC 60654-2:1979/AMD1:1992 | Amendment 1 - Operating conditions for industrial-process measurement and control equipment. Part 2: Power | ||||
| CISPR 20:2006/AMD1:2013 | Amemdment 1 - Sound and television broadcast receivers and associated equipment - Immunity characteristics - Limits and methods of measurement | ||||
| IEC 61069-5:2016 | Industrial-process measurement, control and automation - Evaluation of system properties for the purpose of system assessment - Part 5: Assessment of system dependability | ||||
| IEC 61069-6:2016 | Industrial-process measurement, control and automation - Evaluation of system properties for the purpose of system assessment - Part 6: Assessment of system operability | ||||
| IEC 61069-7:2016 | Industrial-process measurement, control and automation - Evaluation of system properties for the purpose of system assessment - Part 7: Assessment of system safety | ||||
| IEC 61511-1:2016 | Functional safety - Safety instrumented systems for the process industry sector - Part 1: Framework, definitions, system, hardware and application programming requirements | ||||
| IEC 62153-1-1:2003 | Metallic communication cables test methods - Part 1-1: Electrical - Measurement of the pulse/step return loss in the frequency domain using the Inverse Discrete Fourier Transformation (IDFT) | ||||
| CISPR 32:2015 | Electromagnetic compatibility of multimedia equipment - Emission requirements | ||||
| IEC 61076-4-001:1996 | Connectors with assessed quality, for use in d.c., low-frequencyanalogue and in digital high-speed data applications - Part 4:Printed board connectors - Section 001: Blank detail specification | ||||
| IEC 62047-2:2006 | Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials | ||||
| IEC 60748-2-2:1992 | Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU | ||||
| IEC 62047-3:2006 | Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing | ||||
| IEC 60748-2-3:1992 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU) | ||||
| IEC 60748-2-5:1992 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB) | ||||
| IEC 62047-10:2011/COR1:2012 | Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials | ||||
| IEC 60748-2-6:1991 | Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits | ||||
| IEC 60748-2-8:1993 | Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories | ||||
| IEC 62047-15:2015 | Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass | ||||
| IEC 60748-3:1986/AMD2:1994 | Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits | ||||
| IEC 60748-5:1997 | Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits | ||||
| IEC 62047-25:2016 | Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area |
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